Probe Cards - 日本電子材料株式会社

Probe Card

Advanced
Probe Card/M type

• MC Series

  

  MEMS probe card created with MEMS (Micro Electro Mechanical Systems) and thin film multilayer wiring technology. Supports full wafer probing for 300mm wafers.
  MC Series is a probe card technology suitable for DRAM and NAND flash memory devices.

• MT Series

  

  MEMS probe card created with MEMS (Micro Electro Mechanical Systems) and thin film multilayer wiring technology. Supports fine-pitch area arrays by use of vertical MEMS probe. MT Series is a probe technology developed for flip chips with Cu pillar bumps and pads.

Advanced
Probe Card/V type

• VS Series

  

  Vertical probe card with micro spring pins can support various attachment methods such as wire transformer, MLO, MLC and direct attachment.
  VS Series is a probe card technology recommended for flip chip, area array, and wafer-level CSP.

• VC Series

  

  Vertical probe card with buckling structure. Supports 12-inch size wafer batch contact.
  VC Series is a probe card technology designed for high-parallelism testing of memory and logic devices

• VT Series

  

  Cantilever probe cards structurally restrict multi-DUT testing for devices with peripheral pads. VT Series uses a vertical structure, which solves DUT restrictions and improves electrical properties.
  VT Series is a probe card technology designed for multi-DUT testing of logic devices with fine-pitch peripheral pads.

• VE Series

  

  A hybrid probe card structure combining vertical and cantilever probe card features.
  VE Series is a probe card technology developed for high-parallelism testing of CMOS imaging sensors with openings for light source.

Cantilever
Probe Card/C type

• CE Series

  

  Cantilever probe card with cantilever probe wires attached to epoxy ring.
  CE Series is a probe card technology suitable for testing various types of logic IC such as high current automobile devices and application processors from transistor devices.